10 Best Solder For Electronics 2024 in the US

1.

Diameter: 0.031" Inch (0.80mm)

2.

Alloy Composition: 60% Tin / 40% Lead

3.

Core/Flux Type: Rosin Core / 44 Flux (3.3%)

4.

Product Origin: Made in the U.S.A.

5.

Spool Weight: 1 Pound per Spool

1.

Industry Standard: Proven reliability for decades.

2.

Excellent Solderability: Works with various metallizations.

3.

High Activity Rosin Core: Ensures effective soldering.

4.

Bright/Shiny Joints: Leaves visually appealing solder joints.

5.

Standard Core 66: Contains 3.3% flux for optimal performance.

1.

Compact Size: Dimensions of 6.223 x 6.731 x 6.223 cm.

2.

Electronic Component: Designed for electronic applications.

3.

Single Unit: Package contains one electronic component.

4.

Made in USA: Manufactured in the United States.

1.

High Purity Leaded Alloy: 60% tin and 40% lead for effective soldering.

2.

Rosin Activated Flux Core: 2% flux core for smooth solder flow.

3.

Low Melting Temperature: Melts at 183°C-188°C for quick soldering.

4.

Great Conductivity: Ensures strong electrical and thermal connections.

5.

Versatile Applications: Suitable for various electrical repair tasks.

1.

Brand: Kester

2.

Series: 44

3.

Core Type: Activated Rosin Flux Core

4.

Wire Diameter: 0.062 in

5.

Sale Unit: POUND

1.

Pocket Size Pack: 1-ounce pack contains approx 27 feet of solder.

2.

67/37 Tin/Lead: Most common alloy for electronics work.

3.

.031" Diameter: Ideal for fine-pitch electronics work.

4.

High Activity RA: Formulation for effective soldering.

1.

High Tin-Lead Ratio: 63% Tin and 37% Lead for strong joints.

2.

Built-in Rosin Core: Prefluxed, no need to add extra flux.

3.

Easy Melting and Flow: Melts easily and flows consistently.

4.

Low Slag and Smoke: Produces less slag and smoke during use.

5.

Immediate Set: Melts and sets immediately for quick work.

1.

Alloy Composition: 60% Tin, 40% Lead for effective soldering.

2.

Wire Diameter: 0.040 inch (1.00 mm) for medium to large components.

3.

Flux Type: 44 Series promotes instant-action wetting behavior.

4.

Flux Content: 3.3% flux for high mobility and fast spreading.

5.

General Purpose: Ideal for general soldering and reliable production.

1.

Leaded: Contains lead for improved soldering performance.

2.

No Clean: Residue does not require cleaning after soldering.

3.

Syringe: Convenient syringe packaging for easy application.

1.

External Diameter: 1.27mm (Metric), 0.05" (Imperial)

2.

Solder Gauge: 18AWG

3.

Solder Alloy: 60% Sn, 40% Pb

4.

Melting Temperature: 190°C

5.

Weight: 453.592g